In order to develop the development and production capacities of domestic chip-carrying ceramic wafers, GFM assessed domestic R&D capabilities.
The government accepted the proposal of the Ministry of Economic Development (GFM) to launch an R+D+I project for chip-carrying ceramic wafers, so Hungary is also starting to enter the semiconductor manufacturing market. The government is supporting the development of capacities with HUF 1 billion.
Gergely Fábián, the state secretary responsible for industrial policy and technology, emphasized that “the chip shortage experienced during COVID pointed out the vulnerability of the whole of Europe, while Hungary currently has world-class materials research capabilities. Building on this knowledge, by entering the advanced technology market, the competitiveness and sovereignty of the Hungarian economy can be significantly increased, at the same time, the country’s international exposure can be significantly reduced.”
In order to develop the development and production capacities of domestic chip-carrying ceramic wafers, GFM assessed domestic R&D capabilities. According to the multi-phase pilot project, the production capacity can already be built in the medium term.
The state secretary added that the semiconductor business is characterized by rapid technological change, and research and development activities are outstanding at all stages of the value chain. Due to the extensive innovation activity, the project and subsequent developments will make a significant contribution to the promotion of the technological development of the Hungarian economy, to the processes of Industry 4.0, to the technological change of the industry – read the announcement. In fact, we can implement anything on the website.