Intel is currently preparing to launch Arrow Lake and Lunar Lake processors. Both generations will premiere in 2024, but they will use different technological processes (this is probably the main reason that both generations will be able to be released at the same time). Intel Arrow Lake will use the Intel 20A process, while Lunar Lake will go entirely to TSMC factories, where they will use N3 lithography in the N3B variant. Panther Lake will be released next year and will be produced in Intel factories (at least when it comes to Compute Tile) and in the Intel 18A process. According to new information, not only Lunar Lake will be fully manufactured in TSMC factories.
According to unofficial information from Taiwan, Intel plans to use TSMC N2 lithography (2 nm) to produce Nova Lake generation processors.
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Taiwan Economic Daily announced unofficial plans for the use of TSMC N2 (2 nm) lithography by customers of the Taiwanese company. It looks like Apple and Intel will be the main customers for silicon wafers in the new production process. Apple is still to be the most important partner, which is emphasized in the material. At the same time, Intel is also expected to use TSMC technology again to produce Nova Lake processors. The premiere would take place in 2026.
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Not much details are currently known about the Intel Nova Lake generation. Unofficially, there is talk of a 50% increase in performance compared to the Lunar Lake series. The future generation of processors is expected to be simultaneous the biggest technological leap, probably even greater than the introduction of the first generation of Intel Core (there is talk of the introduction of Panther Cove and Darkmont cores). The use of TSMC N2 lithography would make it possible not only to offer a corresponding leap in performance, but also to improve energy efficiency itself. The future will show whether Intel will use TSMC factories again.
Source: WCCFTech, Taiwan Economic Daily